Hewlett Packard Enterprise XL230K GEN10 XEON-P 8176F FRONT KIT IN CHIP
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Hewlett Packard Enterprise XL230K GEN10 XEON-P 8176F FRONT KIT IN CHIP
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Socket
LGA 3647
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Processor frequency
2.1GHz
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CPU cores
28
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CPU threads
56
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CPU family
Intel Xeon® Platinum
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TDP
173W
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Description
Specifications
Options, accessories, services and support for all your HP and Compaq products.
Processor |
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Processor family | Intel® Xeon® Platinum |
Processor frequency | 2.1 GHz |
Processor cores | 28 |
Processor socket | LGA 3647 |
Component for | Server/Workstation |
Processor lithography | 14 nm |
Cooler included | No |
Processor series | Intel Xeon Platinum 8000 Series |
Processor model | 8176F |
Processor threads | 56 |
Processor operating modes | 64-bit |
Processor cache | 38.5 MB |
Processor cache type | L3 |
Processor boost frequency | 3.8 GHz |
Processor codename | Skylake |
Memory |
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Maximum internal memory supported by processor | 768 GB |
Memory types supported by processor | DDR4-SDRAM |
Memory clock speeds supported by processor | 2666 MHz |
Memory channels | Hexa |
ECC | Yes |
Graphics |
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On-board graphics adapter | No |
Power |
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Thermal Design Power (TDP) | 173 W |
Features |
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Execute Disable Bit | Yes |
Maximum number of PCI Express lanes | 48 |
PCI Express slots version | 3.0 |
Supported instruction sets | AVX,AVX 2.0,AVX-512,SSE4.2 |
Scalability | S8S |
Embedded options available | No |
Processor special features |
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Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
Intel® Turbo Boost Technology | 2.0 |
Intel® AES New Instructions (Intel® AES-NI) | Yes |
Enhanced Intel SpeedStep Technology | Yes |
Intel Trusted Execution Technology | Yes |
Intel® Speed Shift Technology | Yes |
Intel TSX-NI | Yes |
Intel 64 | Yes |
Intel Virtualization Technology (VT-x) | Yes |
Conflict-Free processor | Yes |
Intel Turbo Boost Max Technology 3.0 | No |
Intel® Optane™ Memory Ready | No |
Intel® vPro™ Platform Eligibility | Yes |
Operational conditions |
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Tcase | 87 °C |
Other features |
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Compatibility | XL230K GEN10 |
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