LENOVO Intel Xeon Gold 5217 - 3 GHz - 8-core - 16 threads - 11 MB cache - for ThinkAgile VX Certified Node 7Y94, ThinkSystem SR550, SR590, SR650
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LENOVO Intel Xeon Gold 5217 - 3 GHz - 8-core - 16 threads - 11 MB cache - for ThinkAgile VX Certified Node 7Y94, ThinkSystem SR550, SR590, SR650
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Socket
LGA 3647
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CPU cores
8
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CPU threads
16
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Graphics core
Not available
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CPU family
Intel Xeon® Gold
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TDP
115W
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Description
Specifications
Xeon® Gold 5217
11M Cache, 3.00 GHz
Specifications:
Essentials
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Product Collection
2nd Generation Intel® Xeon® Scalable Processors
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Code Name
Products formerly Cascade Lake
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Vertical Segment
Server
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Processor Number
5217
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Lithography
14 nm
CPU Specifications
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# of Cores
8
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# of Threads
16
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Processor Base Frequency
3.00 GHz
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Max Turbo Frequency
3.70 GHz
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Cache
11 MB
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# of UPI Links
2
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TDP
115 W
Memory Specifications
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Max Memory Size (dependent on memory type)
1 TB
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Memory Types
DDR4-2667
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Maximum Memory Speed
2667 MHz
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Max # of Memory Channels
6
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ECC Memory Supported
: Yes
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Intel® Optane™ DC Persistent Memory Supported
: Yes
Expansion Options
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Scalability
4S
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PCI Express Revision
3.0
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Max # of PCI Express Lanes
48
Package Specifications
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Sockets Supported
FCLGA3647
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TCASE
79°C
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Package Size
76.0mm x 56.5mm
Advanced Technologies
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Intel® Deep Learning Boost (Intel® DL Boost)
: Yes
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Intel® Speed Select Technology - Performance Profile
: No
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Intel® Speed Select Technology - Base Frequency
: No
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Intel® Resource Director Technology (Intel® RDT)
: Yes
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Intel® Speed Shift Technology
: Yes
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Intel® Turbo Boost Max Technology 3.0
: No
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Intel® Turbo Boost Technology
2.0
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Intel vPro® Platform Eligibility
: Yes
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Intel® Hyper-Threading Technology
: Yes
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Intel® Virtualization Technology (VT-x)
: Yes
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Intel® Virtualization Technology for Directed I/O (VT-d)
: Yes
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Intel® VT-x with Extended Page Tables (EPT)
: Yes
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Intel® Transactional Synchronization Extensions
: Yes
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Intel® 64
: Yes
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Instruction Set Extensions
Intel® SSE4.2, Intel® AVX, Intel® AVX2, Intel® AVX-512
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# of AVX-512 FMA Units
1
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Enhanced Intel SpeedStep® Technology
: Yes
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Intel® Volume Management Device (VMD)
: Yes
Security & Reliability
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Intel® AES New Instructions
: Yes
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Intel® Trusted Execution Technology
: Yes
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Execute Disable Bit
: Yes
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Intel® Run Sure Technology
: Yes
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Mode-based Execute Control (MBE)
: Yes
Processor |
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Processor manufacturer | Intel |
Processor family | Intel® Xeon® Gold |
Processor generation | 2nd Generation Intel® Xeon® Scalable |
Processor model | 5217 |
Processor base frequency | 3 GHz |
Processor cores | 8 |
Processor socket | LGA 3647 (Socket P) |
Processor lithography | 14 nm |
Component for | Server/workstation |
Processor series | Intel Xeon Gold 5000 Series |
Processor threads | 16 |
Processor operating modes | 64-bit |
Processor boost frequency | 3.7 GHz |
Processor cache | 11 MB |
Processor cache type | Smart Cache |
Thermal Design Power (TDP) | 115 W |
Bus type | UPI |
Processor codename | Cascade Lake |
Memory |
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Maximum internal memory supported by processor | 1 TB |
Memory types supported by processor | DDR4-SDRAM |
Memory clock speeds supported by processor | 2667 MHz |
Memory channels | Hexa-channel |
ECC | Yes |
Graphics |
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On-board graphics card | No |
Discrete graphics card | No |
On-board graphics card model | Not available |
Discrete graphics card model | Not available |
Features |
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Execute Disable Bit | Yes |
Market segment | Server |
Maximum number of PCI Express lanes | 48 |
PCI Express slots version | 3.0 |
Supported instruction sets | AVX-512 |
Scalability | 4S |
Embedded options available | No |
Processor special features |
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Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
Intel® Turbo Boost Technology | 2.0 |
Intel® AES New Instructions (Intel® AES-NI) | Yes |
Enhanced Intel SpeedStep Technology | Yes |
Intel Trusted Execution Technology | Yes |
Intel® Speed Shift Technology | Yes |
Intel VT-x with Extended Page Tables (EPT) | Yes |
Intel TSX-NI | Yes |
Intel 64 | Yes |
Intel Virtualization Technology (VT-x) | Yes |
Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
Intel Turbo Boost Max Technology 3.0 | Yes |
Intel® vPro™ Platform Eligibility | Yes |
Operational conditions |
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Tcase | 79 °C |
Logistics data |
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Harmonized System (HS) code | 85423119 |
Weight & dimensions |
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Processor package size | 76 x 56.5 mm |
Other features |
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Compatibility | ThinkSystem SR550, ThinkSystem SR590, ThinkSystem SR650 |
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